TSMC Joins PLP Race, Challenging Samsung's Head Start

TSMC is gearing up for mass production of panel-level packaging (PLP) technology, directly competing with Samsung, which has years of experience. The Taiwanese firm is launching its CoPoS platform, focusing on glass substrates to enhance chip efficiency. TSMC's pilot production starts soon, aiming for large-scale output by 2027–2029. The industry anticipates fierce competition in this evolving market.