IC-Link Joins TSMC 3DFabric Alliance, Boosts AI Chip Design Capabilities!

IC-Link, imec's commercial chip services arm, recently joined TSMC's 3DFabric Alliance, enabling fabless design teams enhanced access to advanced packaging technologies like CoWoS and SoIC. This partnership allows for co-optimization of chip architecture during initial design phases, crucial for AI and HPC chips. IC-Link is the first European ASIC partner simultaneously holding all three TSMC OIP memberships. Their presentations at the 2026 TSMC North America OIP Forum emphasize cutting-edge packaging solutions.