LG Teams Up with Samsung for Cutting-Edge AI IoT Chips

On August 31, LG Electronics announced a partnership with CoAsia SEMI to develop ultra-low-power AI IoT chips for smart home appliances, uniquely utilizing Samsung Foundry for manufacturing. This collaboration aligns with South Korea's K-On-Device AI initiative, aiming to create efficient always-on sensing technologies. The project has a dedicated budget of ₩31 billion, targeting a competitive edge by optimizing chip design for Samsung's processes, within a four-year development plan.