SK Hynix Unveils Revolutionary 3D Stacked DRAM at SEDEX 2026!

At SEDEX 2026, SK Hynix's Ahn Hyun revealed a groundbreaking 3D Stacked DRAM architecture that bonds DRAM directly to processors, set for mass production by 2028. The company also finalized specs for High-Bandwidth Flash, targeting a complete standard by January 2027. The new memory hierarchy promises to address significant AI infrastructure demands with enhanced performance and co-design requirements.