BOE Technology Joins the AI Chip Packaging Race with Bold New Strategies!

BOE Technology Group has officially entered the AI chip packaging supply chain, prioritizing glass-core substrates and MicroLED technology. Despite its bold ambitions, BOE heavily relies on American and Western technologies, raising geopolitical concerns. The global glass-core packaging market is poised to grow to $8.5 billion by 2028. However, BOE faces production yield challenges and competition from established companies. Its state-linked status adds layers of complexity in international collaborations.